Typical combinations for the semiconductor industry include silver double clad on aluminum, lead and tin alloys clad on all base metals including gold, tin, gold silicon and gold germanium clad on nickel iron, kovar, molybdenum and copper
Combinations produced for the switch and electro-mechanical industries include silver and silver contact materials clad to all available base materials (copper, kovar, phosphor bronze and brass). Silver brazing alloys are available clad to all base metals as discussed above.
Secondary Plating and Milling services are available on all material systems.
Precious metals, base metals and solder alloys can be made as an inlay, overlay, EB weld, or contact material.
PROTOTYPE SAMPLES AVAILABLE IN 2-4 WEEKS.
All Bonding & Rolling Mills Equipped with Vollmer Operator Interface Control and Real Time Spc with CPK Data.